Laserssel to Highlight Advanced LSR Technology at SMTA Guadalajara 2019
Laserssel, the leading provider of Laser Selective Reflow (LSR) to the electronics industry, has today announced they will exhibit in booth #611 at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place October 23-24, 2019 at the Expo Guadalajara in Guadalajara, Mexico.
“We’re very excited to bring our LSR technology to Mexico and share it with everyone attending the Guadalajara show,” commented Denis Barbini, Ph.D., Managing Director of the USA for Laserssel. “SMTA Guadalajara is a very important show for our industry, and I invite anyone with the desire to reduce their typical reflow oven’s 8-minute cycle down to just 10 seconds to stop by booth #611 if they are attending.”
Laser Selective Reflow (LSR) is designed to deliver a uniform, defocused laser beam over a specifically tailored area on a PCB. The uniform defocused beam is controlled and delivered to the product via the BSOM (Beam Shaping Optic Module system) on user defined area. This unique feature permits the user to implement novel soldering solutions not possible with conventional techniques. It also allows the selective application of energy to locations that require soldering while not heating up potentially thermally sensitive areas. LSR is potentially a means to also mitigate or even eliminate the warpage of various packages. It provides a reliable, robust, high yielding and fast, only 1~6 seconds laser soldering time per selected area. It is made possible by highly uniform optic system and distinctive recipe developed by Laserssel.
To learn more about Laserssel, stop by booth #611 at SMTA Guadalajara or visit www.laserssel.com.
About Laserssel
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments. As a pioneer in selective soldering segments, Laserssel has provided customers with unique soldering capabilities to allow to solder on heat sensitive substrates that were considered to be impossible to reflow. Laserssel is now expanding its product offerings in advanced packaging, plastic and organic substrates, very thin substrates with concern of warpage and any other challenges that were difficult, if not impossible, in conventional reflow process. Combined with its extensive knowledge in laser technology and expertise in process technology, Laserssel is well positioned to help customers to solve problems in the space of packaging and assembling the next generation of electronic devices. Please visit www.laserssel.com for more information.