Nihon Superior Co. Ltd., an advanced joining material supplier, has developed a new flux-cored solder wire that greatly reduces spatter compared with conventional cored wire. The new cored-flux, (032) allows the use of a wide range of soldering iron tip temperatures with very little spatter, even with high tip temperatures.
The newly developed (032) is a general purpose, no-clean, halogen-free cored-flux. When paired with the SN100C® lead-free alloy, it provides fast wetting and excellent solder joints, not only on copper (Cu) but also nickel (Ni) substrates. SN100C (032) is a good match for continuous robotic soldering due to the fast wetting and low spattering.
(032) cored-flux is available with the company’s new SN100CVTM lead-free alloy that gains its strength from solute atoms in the tin matrix as well as SAC305 solder.
The test was conducted as a simulated “post soldering process” which is performed as touch-up or repair of parts after initial soldering. Evaluation was conducted with solder tip temperatures of 350° C, 380° C and 410° C.
“Reduced flux spattering at various temperature ranges”
Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new cored-flux, visit www.nihonsuperior.co.jp/english or stop by Booth #511 at SMTA International.