Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials, is pleased to introduce the availability of its DF-3505 series dry-film negative photoresists for wafer level metallization processes. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
The DF-3505 dry-film resist also can be used to create permanent features on wafers. When used in conjunction with the 412-17 EMS adhesion promoter, the resist is capable of surviving HAST testing on silicon wafers. This dry-film is capable of extreme fine line and space definition in complex patterns with resolutions down to 3μm for the DF-3505. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals.
EMS DF-3505 dry-film photoresist is tougher (less brittle) than other negative photoresists on the market with glass transition temperatures ranging from 120°C (by DMA Tan Delta) to 200˚C. The material is hydrophobic in nature, providing chemical and moisture resistance. EMS dry-films are compatible with and can be used in contact with the EMS line of spin-coatable negative tone photoresists.
The DF-3505 dry-film negative photoresist is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photoresists formulated for lift off processes, via sealing and making microfluidic channels on MEMS devices.
For more information about the dry film negative photoresist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.