Ormet Circuits Inc. introduces new Transient Liquid Phase Sintering Paste

Ormet Circuits Inc., a division of EMD Performance Materials, announced the introduction of its new Ormet^® DAP-491-1 Transient Liquid Phase Sintering (TLPS) paste. TLPS pastes are lead-free and high-temperature stable sintering solder systems for semiconductor packaging and assembly. 

Ormet DAP-491-1 is a Pb-free, TLPS paste formulated for attachment of metalized die to metalized substrates. It is processed via lead-free reflow but exhibits extremely high thermal stability beyond 350°C after sintering and will withstand subsequent lead-free reflow temperatures above 260°C without re-melting. 

Ormet DAP-491-1 is an excellent alternative to gold-based and lead-based solders as well as silver-sintering materials for electronic packaging applications requiring high thermal conductivity, high-temperature stability along with standard SMT-compatibility for high-throughput.

Ormet delivers high reliability and environmentally friendly interconnect materials for use in assembled advanced semiconductor packages. For more information, visit www.emdgroup.com. 

About Ormet Circuits Inc., a division of EMD Performance Materials
Ormet Circuits develops and delivers advanced materials for the packaging and assembly of semiconductors and electronics. From R&D customization to high volume scale up, Ormet’s rich portfolio of innovative sintering pastes and alternative solder materials and chemistries enable lead (Pb)-free, gold-free, and nano-free packaging solutions for a wide variety of demanding applications requiring high thermal conductivity, high temperature stability and superior long-term reliability. For more information, visit www.emdgroup.com.