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Stencil Design for Solder Paste, In Process Inspection & Process Defects

March 18, 2019
9:30am – 11:00am US Eastern Time 2:30pm – 4:00pm GMT
Presented by: Bob Willis, SMTA Europe

Overview:
The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow.

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Flexible Circuit Board Design & Assembly with Lead-Free Alloys

April 29, 2019
9:30am – 11:00am US Eastern Time 2:30pm – 4:00pm GMT
Presented by: Bob Willis, SMTA Europe

Overview:
Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don’t; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture.

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