Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials, is pleased to announce the availability of its NR-5000 series liquid negative photoresists for microfluidics and wafer level metallization processes. These material formulations have viscosities optimized for wafer coatings from 5 to 50 µm in thickness.
The NR-5000 series dry-film resist also can be used to create various permanent features on wafers. When used in conjunction with the 412-17 EMS adhesion promoter, the resist is capable of surviving HAST testing on silicon wafers. This liquid resist is capable of extreme fine line and space definition in complex patterns with resolutions down to 3μm. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals.
EMS NR-5000 series liquid resists are tougher (less brittle) than other negative photoresists on the market with glass transition temperatures ranging from 120°C (by DMA Tan Delta) to 200˚C. The material is hydrophobic in nature, providing chemical and moisture resistance. EMS liquid resists are compatible with and can be used in contact with the EMS line of dry-film negative tone photoresists.
The NR-5000 series negative photoresists are the latest addition to Engineered Materials Systems’ full line of film and liquid negative photoresists formulated for lift off processes, via sealing and making microfluidic channels on MEMS devices.
For more information about the dry-film negative photoresist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.