by Mickie | Jan 28, 2021 | Jan '21 Featured PR
VEXOS Selects MIRTEC as 3D AOI ‘Partner of Choice’ MIRTEC is pleased to announce that VEXOS has selected MIRTEC as their 3D AOI ‘Partner of Choice’ based on key performance indicators including Inspection Performance, Gage R$&R, Ease of Programming and Customer...
by Mickie | Jan 28, 2021 | Jan '21
NovaCentrix Hires MaRC Technologies to Bring PulseForge Soldering Tools to the Pacific Northwest NovaCentrix, the industry’s leading provider of photonic curing tools, conductive inks and the new PulseForge® Soldering high-intensity pulsed-light solution, is pleased...
by Mickie | Jan 28, 2021 | Jan '21
EVS Introduces New Large Pot Solder Recovery System with Sealed Cabinet EVS International, the leader in solder recovery, is pleased to introduce the new EVS18KLF Solder Recovery System. The EVS 18KLF has a larger 18kilo/40lbs pot, allowing customers to recover more...
by Mickie | Jan 28, 2021 | Jan '21
Magnalytix® Provides Inside Expert Knowledge with New Tech Corner Magnalytix, the forefront driver in providing real-time reliability solutions for electronics manufacturing, introduces the Magnalytix Technical Library, an enhanced knowledge base located in its Web...
by Mickie | Jan 28, 2021 | Jan '21
SECS/GEM Communication Package Announced for MPM Edison Stencil Printer ITW EAE announces a new SECS/GEM communication package for the MPM® Edison™ Printer. SECS/GEM is a semiconductor market communication standard that provides a common interface between...
