Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently published, through iConnect007, a micro eBook on the evolution of modern low-temperature soldering.
Written by Morgana Ribas and other expert authors from Alpha Assembly Solutions, this book illustrates the importance of chemistry when developing low-temperature solders, and discusses advanced and emerging applications where lower melting point alloys can provide unique assembly solutions. “With the move to lead-free solder, the electronics manufacturing industry now has the opportunity to explore and implement assembly solutions that take advantage of lower temperature materials and processes,” said Ribas, Manager of the Metals Technology Group-R&D at Alpha, part of the MacDermid Performance Solutions group of businesses.
Readers will learn the benefits of low-temperature alloys, such as reducing costs, creating more reliable solder joints, and overcoming design limitations with traditional alloys.
“Due to the recent burgeoning in the use of low-temperature solders within the electronics assembly industry, much has been written about bismuth and tin-based solders and solder pastes. This book does a good job of distilling out the chaff and focusing on the most relevant, valuable information available,” says Raiyo Aspandiar, senior engineer at Intel Corporation.
Download your free copy of the micro eBook today. For more information on Low-Temperature Soldering, visit the Alpha website.